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SDR - Universal

Key Specifications

1. RF capabilities
1.1 Up to 8TX, 8RX, independently tunable
1.2 Direct sampling transceiver
1.3 30 MHz to 4 GHz
1.4 Up to 1.6 GHz bandwidth per channel
1.5 Up to 3.2 GHz aggregated bandwidth per USRP

2. Processing system (PS)
2.1 Quad Core ARM Cortex-A53 (1200 MHz)
2.2 4GB DDR4

3. Programmable logic (PL)
3.1 FPGA: RFSoC ZU28DR
3.2 2X4GB DDR4

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Universal X440/X410 Specifications


Key Specifications

RF capabilities
8 TX, 8 RX, independently tunable
Direct sampling transceiver
30 MHz to 4 GHz
Up to 1.6 GHz bandwidth per channel
Up to 3.2 GHz aggregated bandwidth per USRP
Processing system (PS)Quad Core ARM Cortex-A53 (1200 MHz)
4GB DDR4
Programmable logic (PL)FPGA: RFSoC ZU28DR
2 × 4 GB DDR4
SoftwareUHD version 4.5 or later
RFNoC
GNU Radio
C/C++
Python
OpenEmbedded Linux on A53
SynchronizationREF IN (clock reference input)
PPS IN (PPS time reference)
TRIG IN/OUT
GPSDO included
OCXO included
Sync In Port (for future use)
Digital interfaces2 QSFP28 (10/100 GbE)
Ethernet (1 GbE to PS)
2 USB-C (USB to PS, Console/JTAG)
2 HDMI (GPIO)
Power, form factor12 V DC, 16 A maximum
Half-wide RU
28.5 cm × 22.2 cm × 4.4 cm










003-Figure-3-Ettus-USRP-X440-Connector-Pinout.jpg

USRP X440 Connector Pinout


Table 1. Front Panel Connector Descriptions
ConnectorDescription

DB0, 

DB1

RF0RX 1Input terminal for the RF signal. RX 1 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input channel.
TX/RX 0Output and input terminal for the RF signal. TX/RX 0 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input or output channel.
RF1
RX 1Input terminal for the RF signal. RX 1 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input channel.
TX/RX 0Output and input terminal for the RF signal. TX/RX 0 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input or output channel.
SYNC IN

Input terminal for an external IF signal, which is distributed to all four ADCs. SYNC IN is an MMPX (f) connector. SYNC IN accepts signal frequencies up to 1.3 GHz and maximum input power of +15 dBm.

RF2
RX 1Input terminal for the RF signal. RX 1 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input channel.
TX/RX 0Output and input terminal for the RF signal. TX/RX 0 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input or output channel.
RF3
RX 1Input terminal for the RF signal. RX 1 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input channel.
TX/RX 0Output and input terminal for the RF signal. TX/RX 0 is an MMPX (f) connector with an impedance of 50 Ω and is a single-ended input or output channel.
GPIO 0, GPIO 1General Purpose Input / Output (GPIO) digital terminals. GPIO 0 and GPIO 1 are HDMI Type-A connectors. Output voltage can be configured per individual connector: 1.8 V (default), 2.5 V, or 3.3 V.











Controller

Processing System

CPUQuad Core ARM Cortex-A53 (1200 MHz)
Memory4 GB DDR4, 2.4 GT/s
NVM[1]32 GB eMMC (Pseudo SLC)
RJ451 GbE host connection
USB-CUSB to PS (USB 2.0)
USB Console/JTAG











Programmable Logic

FPGAXilinx RFSoC XCZU28DR Speed Grade -2
Memory2 × 4 GB DDR4, 2.4 GT/s
SD-FEC8 dedicated SD-FEC cores
QSFP282 × 4 lanes
10/100 GbE
GPIO2 HDMI
12 I/O lines per connector
Maximum data rate 100 Mbps
Selectable I/O voltage (3.3 V, 2.5 V, or 1.8 V)
TriggerSMA: Trigger In/Out (3.3 V I/O voltage)











DRAM Performance

FPGA BitfileDRAM Throughput at 16-bit I/Q SamplesApplication
X440_X4_4008 channels at ~450 MSps eachSimultaneous Record and Playback
6 channels at 500 MSps each Simultaneous Record and Playback
8 channels at 500 MSps eachRecord or Playback
X440_X4_16002 channels at 2 GSps eachSimultaneous Record and Playback











Baseband

Maximum I/Q sample rates[2]2 GSps
Number of available channelsUp to 8
ADC resolution12 bit
DAC resolution14 bit











Transmitter

Number of channelsUp to 8
Analog frequency range30 MHz to 4 GHz
Frequency step< 1 Hz
Maximum output power[3]0 dBm
TX/RX settling time0.3 μs
Maximum instantaneous real-time bandwidthUp to 1.6 GHz
TX phase noise, 1 GHz carrier frequency, 23 °C, nominal
1 kHz offset-96 dBc/Hz
10 kHz offset-114 dBc/Hz
100 kHz offset-114 dBc/Hz











TX Measurements

Note: The following figures depict the average TX Maximum Output Power and TX EVM based on two units with 16 channels total measured.


004-Figure-4.jpg

Figure 4. TX Maximum Output Power: 0 dBFS CW, 1 GSps Converter Rate, 0 Hz Waveform Frequency

 

005-Figure-5.-TX-Maximum-Output-Power-0-dBFS-CW,-2.jpg

Figure 5. TX Maximum Output Power: 0 dBFS CW, 2.94912 GSps Converter Rate, 0 Hz Waveform Frequency


006-Figure-6.jpg

Figure 6. TX EVM Bathtub Curves: 5GNR, UL, FDD, SISO, 100 MHz BW, 30 kHz SCS, 256 QAM


Note: The following tables depict the isolation performance of the transmitter based on two units with a total of 16 channels at 23°C. The transmitter channel was set to 0 dBFS. Minimum represents the worst performing channel-to-channel combination measured. Average represents the mean value of all channel-to-channel combinations measured.


TX-TX Isolation

FrequencyMinimumAverageUnits
500 MHz69
108
dBc
2 GHz 58
103
3.5 GHz49
92











TX-RX Isolation

FrequencyMinimumAverageUnits
500 MHz74
88
dBc
2 GHz 61
80
3.5 GHz51
68











Receiver

Number of channelsUp to 8
Analog frequency range30 MHz to 4 GHz
Frequency step< 1 Hz
Maximum instantaneous real-time bandwidthUp to 1.6 GHz
Maximum input power, damage level
< 2.5 GHz  +13 dBm continuous
2.5 GHz – 3.6 GHz+17 dBm continuous
3.6 GHz – 4 GHz+20 dBm continuous











RX Measurements

Note: The following figures depict the average RX input power to reach 0 dBFS and RX EVM based on two units with a total of 16 channels measured.


007-Figure-7-RX-Input-Power-to-Reach-0-dBFS--CW-Input.jpg

Figure 7. RX Input Power to Reach 0 dBFS: CW Input

 

008-Figure-8.jpg

Figure 8. RX EVM Bathtub Curves: 5GNR, UL, FDD, SISO, 100 MHz BW, 30 kHz SCS, 256 QAM


Note: The following tables depict the isolation performance of the receiver based on two units with 16 channels total measured at 23°C. The input power of the source channel was kept at a level of -2 dBFS. Minimum represents the worst performing channel-to-channel combination measured. Average represents the mean value of all channel-to-channel combinations measured.


RX-TX Isolation

FrequencyMinimumAverageUnits
500 MHz93
117
dBc
2 GHz 83
107
3.5 GHz72
116











RX-RX Isolation

FrequencyMinimumAverageUnits
500 MHz71
95
dBc
2 GHz 56
93
3.5 GHz55
99











Phase Coherency

Measurement Conditions

Master Clock Rate [Hz]Converter Rate [GSps]Carrier Frequency [GHz]FPGA Bit-file
125e61
0.8
X440_X4_400
307.2e62.46
1.69
X440_X4_400
360e62.88
1.95
X440_X4_400
368.64e62.95
2.4
X440_X4_400
400e63.2
2.6
X440_X4_400
500e64
2.75
X440_X4_400
1000e64
3
X440_X4_1600
2000e64
3
X440_X4_1600








Configured Baseband Stimulus
Wideband SignalCarrier frequency in the second Nyquist Zone
Duration (Phase Stability)2 hours
Iterations (Phase Repeatability) 100 times










Configuration
Same DeviceStimulus simultaneously transmitted and received at up to four channels on the same USRP
Device-to-DeviceStimulus simultaneously transmitted and received at up to four channels on a separate USRP










Synchronization
Shared 10 MHz Square Wave Reference Sourced from OctoClock-G CDA-2990
Shared PPS Sourced from OctoClock-G CDA-2990










Note: The following table depicts channel-to-channel phase stability. Stability was measured on two units with up to eight channels total (up to four channels each) measured at 23°C after device warmup.


TX Phase Stability

Master Clock Rate [Hz] Same Device       Device-to-Device
Peak-to-Peak [deg]RMS [deg]  Peak-to-Peak [deg]  RMS [deg]
125e6< 1< 0.2< 2< 0.35
307.2e6< 1.7< 0.35< 3.5< 0.55
360e6< 2< 0.35< 4< 0.65
368.64e6< 2.6< 0.4< 5< 0.8
400e6< 2.6< 0.45< 5.3< 0.85
500e6< 2.5< 0.45< 5.5< 0.85
1000e6< 1< 0.15< 3.8< 0.6
2000e6< 0.8< 0.15< 4< 0.6









RX Phase Stability

Master Clock Rate [Hz] Same Device       Device-to-Device
Peak-to-Peak [deg]RMS [deg]  Peak-to-Peak [deg]  RMS [deg]
125e6< 0.15
< 0.1< 1.5< 0.2
307.2e6< 0.15< 0.1< 2.5

< 0.35

360e6< 0.25< 0.1< 2.5< 0.4
368.64e6< 0.5< 0.1< 3.5< 0.5
400e6< 0.4< 0.1< 3.5< 0.55
500e6< 0.3< 0.1< 3.5< 0.6
1000e6< 0.35< 0.1< 4< 0.6
2000e6< 0.35< 0.1< 4< 0.6










Phase Repeatability

Note: The following table depicts channel-to-channel phase repeatability. Repeatability was measured on one unit with up to eight channels total measured at 23 °C after device warmup.

Master Clock Rate [Hz]  Same Device [TX] Same Device [RX]
 Peak-to-Peak [deg]Peak-to-Peak [deg]
125e6< 1.15< 0.45
307.2e6< 2< 0.7
360e6< 2.8< 0.5
368.64e6< 2.8< 1
400e6< 2.6< 1.6
500e6< 2.8< 1
1000e6< 2.5< 0.5
2000e6< 1.8< 0.5




GPS Disciplined Oscillator (GPSDO)

Frequency accuracy[4]
OCXO (not locked to GPS)[5]2.5 ppm
OCXO (locked to GPS)5 ppb









Active antenna
Voltage3.3 V
Power0.19 W
Frequency band(s) L1, C/A 1.574 GHz









Power

Voltage rating12 V
Frequency ratingDC
Current/power rating3 A to 16 A (bitfile dependent)
Power supply190 W, minimum










Physical Characteristics

Dimensions

Enclosure26.7 cm × 22.2 cm × 4.4 cm (10.5 in. × 8.7 in. × 1.7 in.)
Enclosure and connectors28.5 cm × 22.2 cm × 4.4 cm (11.2 in. × 8.7 in. × 1.7 in.)
Weight2.7 kg (6 lb)









Ventilation Clearance and Cooling

This product is designed to operate on a bench or in an instrument rack. Fan vents are located at the back of the product. Standard airflow provision of the product is set up as front to back cooling with option to change the airflow direction in the interest for directing back to front cooling using a fan cartridge accessory.

Adequate clearance is required at the front and back of the product and surrounding equipment, inclusive of indiscriminate heat generating devices, and any potential air flow blockages must be maintained to ensure proper cooling.

Minimum cooling clearances51 mm (2 in.) at the front and back









Environment

Operating temperature range 0 °C to 55 °C
Storage temperature range-40 °C to 71 °C
Maximum altitude2,000 m (800 mbar) (at 25 °C ambient temperature)
Operating humidity range10% to 90%, noncondensing
Storage humidity range5% to 95%, noncondensing
Pollution Degree2









Shock and Vibration

Operating vibration5 Hz to 500 Hz, 0.3 g RMS
Non-operating vibration5 Hz to 500 Hz, 2.4 g
RMS operating shock30 g, half-sine, 11 ms pulse
Non-operating shock50 g, half-sine, 11 ms pulse









1 Module assembly D and earlier has an NVM of 16 GB. All other module assemblies have an NVM of 32 GB.

2 The applicable maximum value depends on the Master Clock Rate selected in software.

3 Maximum output power varies by selected Master Clock Rate and frequency.

4 Frequency accuracy is based on oven-controlled crystal oscillator (OCXO) vendor specifications and is not measured. Alternatively, you can incorporate an external reference source to provide a more precise frequency Reference Clock and to achieve better frequency accuracy.

5 Factory default accuracy. 


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