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For long‑term system reliability and after‑sales support, we highly recommend you source both VPX boards and chassis from the same manufacturer.
This eliminates compatibility risks between backplane, power supply, cooling and FPGA boards, and ensures a single‑point responsibility for all technical issues.
3U VPX Compact FPGA Boards
This 3U VPX compact rugged board series follows industrial rugged standards, featuring compact structure, wide-temperature operation, multiple cooling options and comprehensive high-speed interfaces.
It adopts mainstream Xilinx FPGA and TI multi-core DSP architectures, supporting RF signal processing, real-time computing, parallel floating-point operation and high-speed data acquisition. Equipped with complete software and drivers, the boards serve embedded processing and wireless communication applications.
Standard VPX design delivers excellent compatibility and expandability.
Product Selection Table
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory Capacity | High-speed Interface Type | Power Consumption | Operating Temperature | Core Application Scenario |
| EL12PRCA1A001 | XCZU47DR RFSoC | TMS320C6678 DSP | 4CH RF Transceiver | 5GSPS ADC, 9.85GSPS DAC | RFSoC:768MB, DSP:512MB | QSFP,SRIO GBE | ≤45W | -40℃ ~+70℃ | Radar Reconnaissance,SDR |
| EL12PRCA1A002 | XCZU15EG | TMS320C6678 DSP | None | SRIO 5Gbps/lane | Total 12GB DR3/DDR4 | GTX,SRIO, SGMII | ≤50W | -40℃ ~+85℃ | Embedded Parallel Computing |
| EL12PRCA1A003 | XC3S200AN | Dual TMS320C6678 DSP | None | HyperLink High-speed Interconnection | 2GB per DSP | PCIe,SRIO, HyperLink | ≤30W | -40℃ ~+85℃ | Massive Floating-point Calculation |
| EL12PRCA1A004 | XCZU47DR RFSoC | None | 8T8R RF Transceiver | 5GSPS ADC, 9.85GSPS DAC | PL 8GB, PS 4GB DDR4 | 16×GTY, LVDS | ≤45W | -40℃ ~+70℃ | Multi-beam Phased Array Radar |
| EL12PRCA1A005 | XCZU47DR RFSoC Gen3 | Quad-core Cortex-A53 | 8T8R RF Transceiver | PCIe4.0 8GB/s | 12GB Total DDR4 | PCIe4.0,GBE, USB3.0 | 12V Single Power | -40℃ ~+85℃ | 5G/Satellite Communication |
| EL12PRCA1A006 | XC7Z035 | Dual Cortex-A9 | AD9361 2T2R | Max 56MHz Bandwidth | 2GB Total DDR3 | 4×GTX, PCIe×4 | 12V/5V Power | -40℃ ~+80℃ | Unmanned Platform Wireless Communication |
| EL12PRCA1A007 | XCKU115 | None | None | PCIe3.0 8Gbps/lane | Max 4GB DDR3 | FMC+,SRIO, PCIe | 18W Max | -40℃ ~+85℃ | High-density Algorithm Acceleration |
| EL12PRCA1A008 | XC7VX690T | None | None | SRIO 6.25Gbps/lane | 8GB Total DDR3 | FMC HPC, SRIO,PCIe | 48W Max | -40℃ ~+80℃ | Radar Imaging,Big Data Processing |
| EL12PRCA1A010 | XC7K325T | None | None | PCIe2.0 5Gbps/lane | Max 4GB DDR3 | FMC HPC, SRIO,PCIe | 18W Max | -40℃ ~+85℃ | General Real-time Signal Processing |
| EL12PRCA1A011 | XC7VX690T | None | None | 16×GTH High-speed Bus | 8GB DDR3 | FMC HPC ,LVDS,GBE | 48W | -20℃ ~+65℃ | High-speed Image Processing |
| EL12PRCA1A012 | XC7K325T | None | None | 8×GTX Bus | 2GB DDR3 | FMC HPC, PCIe,SRIO | 36W | -20℃ ~+65℃ | FFT Acceleration,Data Acquisition |
| EL12PRCA1A014 | XC7Z045 | Integrated ARM | None | PCIe2.0 5Gbps/lane | 3GB Total DDR3 | FMC HPC, Multi-GBE | 36W Max | -40℃ ~+80℃ | Embedded Intelligent Control |
| EL12PRCA1A015 | XC7Z100 | Integrated ARM | None | PCIe2.0 5Gbps/lane | 3GB Total DDR3 | FMC HPC, Multi-GBE | 36W Max | -40℃ ~+80℃ | High-end Embedded System |
Product No.: EL12PRCA1A004
VPX47‑8T8R 3U VPX 8×8 Direct RF Sampling Processing Platform
Second‑Generation Zynq UltraScale+ RFSoC Ruggedized MIMO Platform
Key Features
3U VPX rugged platform based on XCZU47DR RFSoC. Adopts 8×8 RF ADC/DAC for direct RF sampling, ideal for MIMO and beamforming. Equipped with large-capacity DDR4 and QSPI Flash, supporting stable operation in wide temperature range. Rich high-speed interfaces enable multi-board cascading and high-throughput system integration.
Specifications
| SoC | 2nd-Gen Zynq UltraScale+ RFSoC XCZU47DR | ||||||||
| Form Factor | 3U VPX | ||||||||
| RF Sampling | 8×14-bit ADC @5GSPS, 8×14-bit DAC @9.85GSPS | ||||||||
| Memory | PS 4GB DDR4, PL 8GB DDR4 | ||||||||
| Storage | 1 × QSPI Flash | ||||||||
| High-Speed Interface | 16×GTY, 8×LVDS | ||||||||
| Peripherals | Gigabit Ethernet, UART, RS422, USB Debug | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 28V DC (VPX backplane power) | ||||||||
| Power Consumption | ≤45W | ||||||||
Technical Support
BSP support and custom development available.
Block Diagram
Applications
Broadband wireless communication, array signal processing, multi-channel data acquisition and analysis
Ordering
| PN: | EL12PRCA1A004 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A001
VPX47 DSP 3U VPX Heterogeneous RF Sampling & DSP Processing Platform
RFSoC XCZU47DR + TMS320C6678 High Reliability Signal Processing Platform
Key Features
3U VPX heterogeneous platform built on XCZU47DR RFSoC and 8-core DSP. Integrated 4-channel RF ADC/DAC for direct RF sampling. High-speed EMIF & SRIO enable efficient inter-chip data exchange. Supports clock configuration and remote firmware update. Ample memory and rich interfaces ensure stable high-speed transmission under wide temperature.
Specifications
| SoC | Zynq UltraScale+ XCZU47DR + TMS320C6678 Octal-Core DSP | ||||||||
| Form Factor | 3U VPX | ||||||||
| RF Sampling | 4×14-bit ADC @5GSPS, 4×DAC | ||||||||
| Inter-Chip Interface | EMIF, SRIO | ||||||||
| Memory | RFSoC: PS 256MB DDR4, PL 512MB DDR4; DSP: 512MB DDR3 | ||||||||
| Storage | 1 × QSPI Flash | ||||||||
| High-Speed Interface | 4 × QSFP | ||||||||
| Peripherals | Gigabit Ethernet, RS422, LVDS, SRIO | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 18~36V VPX backplane power | ||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
Wireless communication, signal measurement, industrial computing
Ordering
| PN: | EL12PRCA1A001 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A007
XCKU115 3U VPX FMC+ High-Performance Data Preprocessing Platform
3U VPX Kintex UltraScale+ Platform with FMC+ Interface, PCIe Gen3 and SRIO Backplane Connectivity
Key Features
3U VPX platform based on Xilinx XCKU115 FPGA. Compliant with VITA64, equipped with high-speed FMC+ expansion and dual-protocol backplane interconnection. Configured with multi-group cache, dual Flash, clock management and monitoring module, stable wide-temperature operation, outstanding computing performance and scalability.
Specifications
| FPGA | XCKU115 | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane Interface | P2: PCIe Gen3 x8@8Gbps/lane, 5GB/s | ||||||||
| P1: 4×SRIO x4@5Gbps/lane | |||||||||
| FMC+ Interface | VITA57.4, 16Gbps/lane GTH, 80 pairs LVDS, max 15W power | ||||||||
| Memory & Storage | 5 independent DDR4 banks, dual SPI Nor Flash | ||||||||
| Onboard Module | Clock unit, STM32 IPMB controller | ||||||||
| Physical Spec. | 100×160mm, max 1.5A@+12V | ||||||||
| Operation Temp. | -40℃~+85℃ | ||||||||
| Natural cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, high-speed data acquisition, image processing
Ordering
| PN: | EL12PRCA1A007 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A006
3U‑VPX Xilinx Zynq‑7000 XC7Z035 + AD9361 Rugged SDR Wireless‑Communication Board
Zynq‑7000 SDR Core, AD9361 Wide‑Band RF, 3U‑VPX Rugged Industrial Wireless Platform
Key Features
3U VPX rugged SDR board adopts XC7Z035 SoC and AD9361 RF transceiver. It integrates dual-core Cortex-A9 and FPGA logic, with 2Tx/2Rx RF channels covering 70 MHz–6 GHz and max 56 MHz bandwidth. Equipped with DDR3 memory and rich interfaces for industrial wireless applications.
Specifications
| Form Factor | 3U VPX | ||||||||
| SoC | XC7Z035 | ||||||||
| RF Transceiver | ADI AD9361, 2Tx/2Rx, 70 MHz–6 GHz, 200 kHz–56 MHz, 12bit @61.44 MSPS | ||||||||
| Memory & Storage | PS: 1GB DDR3, eMMC, SD Card, QSPI Flash | ||||||||
| PL: 1GB DDR3 | |||||||||
| High-Speed Interfaces | 4×GTX, PCIe ×4, Gigabit Ethernet, USB, RS232, GPIO | ||||||||
| Front Panel I/O | 2 RF input, 2 RF output | ||||||||
| Software | U-Boot, Linux 4.6, Vivado, full driver & demo routines | ||||||||
| Power Supply | +12 V / +5 V | ||||||||
Technical Support
BSP support and custom development available.
Block Diagram
Applications
Small cell base station, industrial wireless system, general SDR
Ordering
| PN: | EL12PRCA1A006 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A008
XC7VX690T 3U VPX FMC HPC High-Performance Data Preprocessing Platform
3U VPX Virtex-7 FPGA Platform with FMC HPC Interface, SRIO and PCIe Backplane Connectivity
Key Features
3U VPX platform based on XC7VX690T. FMC HPC port enables flexible card expansion, paired with multi-protocol backplane high-speed transmission. Dual DDR3 memory offers large-capacity buffering. STM32 chip supports status monitoring and system management. Dual cooling modes ensure reliable wide-temperature operation.
Specifications
| FPGA | XC7VX690T | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane Link | 4×SRIO x4@6.25Gbps/lane, PCIe x4@5Gbps/lane, Gigabit Ethernet | ||||||||
| FMC+ Interface | VITA57.4, GTH, LVDS, adjustable power | ||||||||
| Memory | 2×4GB 64-bit DDR3 | ||||||||
| Storage | 512Mbit SPI Flash | ||||||||
| Physical Spec. | 100×160mm, max 4A@+12V | ||||||||
| Operation Temp. | -40℃~+80℃ | ||||||||
| Air & conduction cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, image processing
Ordering
| PN: | EL12PRCA1A008 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A015
XC7Z100 3U VPX Zynq-7000 High-End Embedded Processing Platform
3U VPX Zynq-7000 XC7Z100 Heterogeneous Platform with FMC HPC Interface and PCIe Backplane Connectivity
Key Features
Heterogeneous 3U VPX platform based on XC7Z100 SoC. Configured with VITA57.1 FMC HPC interface and PCIe Gen2 high-speed backplane. Matched with independent DDR3 and onboard storage for PL/PS operation. Built-in STM32 chip supports status monitoring and IPMB management. Supporting wide-temperature stable operation for complex high-speed signal processing scenarios.
Specifications
| SoC | XC7Z100 | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane | PCIe Gen2 x8@5Gbps/lane, dual Gigabit Ethernet, configurable GPIO | ||||||||
| FMC Interface | VITA57.1, 8-channel GTX, 84 pairs LVDS, IIC bus | ||||||||
| Memory | PL: 2GB DDR3 | ||||||||
| PS: 1GB DDR3 | |||||||||
| Storage | 32GB eMMC, 256Mbit SPI Flash, TF card slot, UART console port | ||||||||
| Physical Spec. | 100×160mm, max 3A@+12V | ||||||||
| Operation Temp. | -40℃~+80℃ | ||||||||
| Air & conduction cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, image processing
Ordering
| PN: | EL12PRCA1A015 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Contact: Windy Lian
Phone: 13862120662
E-mail: sales@north-bridges.com
Whatsapp:
Add: Suzhou City, China
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