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Note:
Product specifications on the website are for reference only, subject to the latest manufacturer-confirmed datasheet. Please contact us for official technical documents before project evaluation and quotation.
Operating system, BSP, drivers and SDK vary by hardware batch. Please contact us for official software compatibility documents before project development.
3U VPX Compact FPGA Boards
This 3U VPX compact rugged board series follows industrial rugged standards, featuring compact structure, wide-temperature operation, multiple cooling options and comprehensive high-speed interfaces.
It adopts mainstream Xilinx FPGA and TI multi-core DSP architectures, supporting RF signal processing, real-time computing, parallel floating-point operation and high-speed data acquisition. Equipped with complete software and drivers, the boards serve embedded processing and wireless communication applications.
Standard VPX design delivers excellent compatibility and expandability.
Product Selection Table
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory | High-speed Interface | Power Consumption | Operating Temperature | Application Scenario |
| EL12PRCA1A001 | XCZU15EG | TMS320C6678 DSP | None | SRIO 5Gbps/lane | Total 12GB DR3/DDR4 | GTX,SRIO, SGMII | ≤50W | -40℃ ~+85℃ | Embedded Parallel Computing |
| EL12PRCA1A002 | XC3S200AN | Dual TMS320C6678 DSP | None | HyperLink High-speed Interconnection | 2GB per DSP | PCIe,SRIO, HyperLink | ≤30W | -40℃ ~+85℃ | Massive Floating-point Calculation |
| EL12PRCA1A003 | XC7Z035 | Dual Cortex-A9 | AD9361 2T2R | Max 56MHz Bandwidth | 2GB Total DDR3 | 4×GTX, PCIe×4 | 12V/5V Power | -40℃ ~+80℃ | Unmanned Platform Wireless Communication |
| EL12PRCA1A004 | XCKU115 | None | None | PCIe3.0 8Gbps/lane | Max 4GB DDR3 | FMC+,SRIO, PCIe | 18W Max | -40℃ ~+85℃ | High-density Algorithm Acceleration |
| EL12PRCA1A005 | XCVU3P | None | None | 16×GTH transceivers, PCIe3.0 ×8 per link | 2×8GB DDR4 + BPI Configuration Flash | FMC+ HSPC, GTH, PCIe3.0, LVDS differential | 50W Max, +12V input | -20℃ ~ +65℃ | IF signal preprocessing, RF data relay |
| EL12PRCA1A006 | XC7VX690T | None | None | SRIO 6.25Gbps/lane | 8GB Total DDR3 | FMC HPC, SRIO,PCIe | 48W Max | -40℃ ~+80℃ | Radar Imaging,Big Data Processing |
| EL12PRCA1A008 | XC7K325T | None | None | PCIe2.0 5Gbps/lane | Max 4GB DDR3 | FMC HPC, SRIO,PCIe | 18W Max | -40℃ ~+85℃ | General Real-time Signal Processing |
| EL12PRCA1A009 | XC7VX690T | None | None | 16×GTH High-speed Bus | 8GB DDR3 | FMC HPC ,LVDS,GBE | 48W | -20℃ ~+65℃ | High-speed Image Processing |
| EL12PRCA1A010 | XC7K325T | None | None | 8×GTX Bus | 2GB DDR3 | FMC HPC, PCIe,SRIO | 36W | -20℃ ~+65℃ | FFT Acceleration,Data Acquisition |
| EL12PRCA1A012 | XC7Z045 | Integrated ARM | None | PCIe2.0 5Gbps/lane | 3GB Total DDR3 | FMC HPC, Multi-GBE | 36W Max | -40℃ ~+80℃ | Embedded Intelligent Control |
| EL12PRCA1A013 | XC7Z100 | Integrated ARM | None | PCIe2.0 5Gbps/lane | 3GB Total DDR3 | FMC HPC, Multi-GBE | 36W Max | -40℃ ~+80℃ | High-end Embedded System |
Product No.: EL12PRCA1A004
XCKU115 3U VPX High-Performance FMC+ Carrier Signal Pre-Processing Platform
3U VPX Kintex UltraScale+ Platform with FMC+ Interface, PCIe Gen3 and SRIO Backplane Connectivity
Key Features
3U VPX platform based on Xilinx XCKU115 FPGA. Compliant with VITA64, equipped with high-speed FMC+ expansion and dual-protocol backplane interconnection. Configured with multi-group cache, dual Flash, clock management and monitoring module, stable wide-temperature operation, outstanding computing performance and scalability.
Specifications
| FPGA | XCKU115 | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane Interface | P2: PCIe Gen3 x8@8Gbps/lane, 5GB/s | ||||||||
| P1: 4×SRIO x4@5Gbps/lane | |||||||||
| FMC+ | VITA57.4, 16Gbps/lane GTH, 80 pairs LVDS, max 15W power | ||||||||
| Memory & Storage | 5 independent DDR4 banks, dual SPI Nor Flash | ||||||||
| Onboard Module | Clock unit, STM32 IPMB controller | ||||||||
| Physical Spec. | 100×160mm, max 1.5A@+12V | ||||||||
| Operation Temp. | -40℃~+85℃ | ||||||||
| Natural cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, high-speed data acquisition, image processing
Ordering
| PN: | EL12PRCA1A004 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A003
XC7Z035 + AD9361 3U VPX Rugged 2Tx/2Rx SDR Wireless‑Communication Platform
Zynq‑7000 SDR Core, AD9361 Wide‑Band RF, 3U‑VPX Rugged Industrial Wireless Platform
Key Features
3U VPX rugged SDR board adopts XC7Z035 SoC and AD9361 RF transceiver. It integrates dual-core Cortex-A9 and FPGA logic, with 2Tx/2Rx RF channels covering 70 MHz–6 GHz and max 56 MHz bandwidth. Equipped with DDR3 memory and rich interfaces for industrial wireless applications.
Specifications
| Form Factor | 3U VPX | ||||||||
| FPGA | XC7Z035 | ||||||||
| RF Transceiver | ADI AD9361, 2Tx/2Rx, 70 MHz–6 GHz, 200 kHz–56 MHz, 12bit @61.44 MSPS | ||||||||
| Memory & Storage | PS: 1GB DDR3, eMMC, SD Card, QSPI Flash | ||||||||
| PL: 1GB DDR3 | |||||||||
| High-Speed Interfaces | 4×GTX, PCIe ×4, Gigabit Ethernet, USB, RS232, GPIO | ||||||||
| Front Panel I/O | 2 RF input, 2 RF output | ||||||||
| Software | U-Boot, Linux 4.6, Vivado, full driver & demo routines | ||||||||
| Power Supply | +12 V / +5 V | ||||||||
Technical Support
BSP support and custom development available.
Block Diagram
Applications
Small cell base station, industrial wireless system, general SDR
Ordering
| PN: | EL12PRCA1A003 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A006
XC7VX690T 3U VPX High-Performance FMC+ Carrier Signal Pre-Processing Platform
3U VPX Virtex-7 FPGA Platform with FMC HPC Interface, SRIO and PCIe Backplane Connectivity
Key Features
3U VPX platform based on XC7VX690T. FMC HPC port enables flexible card expansion, paired with multi-protocol backplane high-speed transmission. Dual DDR3 memory offers large-capacity buffering. STM32 chip supports status monitoring and system management. Dual cooling modes ensure reliable wide-temperature operation.
Specifications
| FPGA | XC7VX690T | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane Link | 4×SRIO x4@6.25Gbps/lane, PCIe x4@5Gbps/lane, Gigabit Ethernet | ||||||||
| FMC+ | VITA57.4, GTH, LVDS, adjustable power | ||||||||
| Memory | 2×4GB 64-bit DDR3 | ||||||||
| Storage | 512Mbit SPI Flash | ||||||||
| Physical Spec. | 100×160mm, max 4A@+12V | ||||||||
| Operation Temp. | -40℃~+80℃ | ||||||||
| Air & conduction cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, image processing
Ordering
| PN: | EL12PRCA1A006 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A013
XC7Z100 3U VPX Heterogeneous FMC Carrier Signal Pre-Processing Platform
3U VPX Zynq-7000 XC7Z100 Heterogeneous Platform with FMC HPC Interface and PCIe Backplane Connectivity
Key Features
Heterogeneous 3U VPX platform based on XC7Z100 SoC. Configured with VITA57.1 FMC HPC interface and PCIe Gen2 high-speed backplane. Matched with independent DDR3 and onboard storage for PL/PS operation. Built-in STM32 chip supports status monitoring and IPMB management. Supporting wide-temperature stable operation for complex high-speed signal processing scenarios.
Specifications
| FPGA | XC7Z100 | ||||||||
| Form Factor | 3U VPX | ||||||||
| Backplane | PCIe Gen2 x8@5Gbps/lane, dual Gigabit Ethernet, configurable GPIO | ||||||||
| FMC | VITA57.1, 8-channel GTX, 84 pairs LVDS, IIC bus | ||||||||
| Memory | PL: 2GB DDR3 | ||||||||
| PS: 1GB DDR3 | |||||||||
| Storage | 32GB eMMC, 256Mbit SPI Flash, TF card slot, UART console port | ||||||||
| Physical Spec. | 100×160mm, max 3A@+12V | ||||||||
| Operation Temp. | -40℃~+80℃ | ||||||||
| Air & conduction cooling | |||||||||
Technical Support
BSP support and custom development available
Block Diagram
Applications
RF/IF signal processing, SDR, image processing
Ordering
| PN: | EL12PRCA1A013 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A005
XCVU3P 3U VPX High‑Performance FMC+ Carrier Signal Pre‑Processing Platform
XCVU3P UltraScale+ Core, 3U‑VPX High‑Speed FMC+ Carrier Real‑Time Signal‑Processing Platform
Key Features
3U VPX form factor, compliant with VITA57.4 FMC+ HSPC spec
Xilinx XCVU3P UltraScale+ 16nm high-performance processing core
16-channel GTH transceivers, dual PCIe3.0 ×8 backplane links
Dual bank DDR4 large buffer for steady high-speed data throughput
Industrial wide-temperature range, rapid system integration with FMC I/O daughter cards
Specifications
| Form Factor | 3U VPX, VITA46 | ||||||||
| Chip | XCVU3P | ||||||||
| FMC+ | VITA57.4, 1× HSPC | ||||||||
| High-Speed Transceivers | 16× GTH | ||||||||
| 2× PCIe3.0 ×8 | |||||||||
| I/O | 16 differential LVDS pairs | ||||||||
| Memory | 2×8GB DDR4, BPI Configuration Flash | ||||||||
| Power Input | +12V DC, Max Power ≤50W | ||||||||
| Operating Temp | -20℃ ~ +65℃ | ||||||||
| Dimension | 100mm × 160mm | ||||||||
Block Diagram
Applications
RF/IF signal processing, SDR, image processing, modular instrumentation platforms
Ordering
| PN: | EL12PRCA1A005 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Product No.: EL12PRCA1A001
XCZU15EG + TMS320C6678 3U VPX Heterogeneous DSP‑FPGA Rugged Signal‑Processing Platform
DSP‑FPGA Heterogeneous Core, Dual Cooling Compatible, 3U‑VPX Rugged High‑Speed Signal‑Processing Platform
Key Features
3U VPX rugged heterogeneous processing platform built on TMS320C6678 multi-core DSP and XCZU15EG Zynq UltraScale+ MPSoC, with STM32 MCU for power management and status monitoring. It adopts dual cooling design compatible with air cooling and conduction cooling. Equipped with multi-bank DDR3/DDR4 memory, high-speed SRIO and SGMII inter-chip interfaces, together with abundant GTX transceivers, Ethernet and serial ports.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | DSP: TMS320C6678 | ||||||||
| FPGA: XCZU15EG | |||||||||
| MCU: STM32F103 | |||||||||
| Memory | DSP: 4GB DDR3 | ||||||||
| FPGA: PS: 4GB DDR4, PL: 4GB DDR4 | |||||||||
| Inter-Chip Bus | DSP-FPGA: SRIO×4 @5Gbps, SGMII | ||||||||
| EMIF16, GPIO, SPI, UART | |||||||||
| VPX Interfaces | P1: 16×GTX, 4×SRIO×4 | ||||||||
| P2: 8×RS422, 2×RS232, Gigabit Ethernet, 2×SGMII, TTL-IO | |||||||||
| Storage | DSP: 32MB SPI Flash | ||||||||
| FPGA: QSPI, SD Card, eMMC | |||||||||
| Debug Interface | Multi-channel JTAG, Micro-USB debug port, status LED indicators | ||||||||
| Power Input | 12V DC / 5A, ≤50W | ||||||||
| Dimension | 100mm × 160mm | ||||||||
| Operating Temp. | -40°C ~ +85°C | ||||||||
Technical Support
BSP support and custom development available.
Block Diagram
Applications
High-speed signal processing, SDR, communication baseband processing and multi-node parallel computing systems
Ordering
| PN: | EL12PRCA1A001 | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Contact: Windy Lian
Phone: 13862120662
E-mail: sales@north-bridges.com
Whatsapp:
Add: Suzhou City, China
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