VPX AI/GPU Accelerator Boards

Note:
Product specifications on the website are for reference only, subject to the latest manufacturer-confirmed datasheet. Please contact us for official technical documents before project evaluation and quotation.
Operating system, BSP, drivers and SDK vary by hardware batch. Please contact us for official software compatibility documents before project development.

VPX AI/GPU Accelerator Boards

This series of rugged VPX AI/GPU accelerator boards features diversified high-performance computing architectures in standard 3U/6U VPX form factors.

Wide-temperature design guarantees stable operation under extreme ambient conditions, supporting real-time video analysis, multi-sensor fusion and large-scale parallel data processing for aviation, industrial and mobile embedded applications.

Product Selction Table

Part Number

Form

Factor

Operating

Temperature

Onboard

Memory

AI Peak

Computing

Performance

Main

Processing

Chip

High-speed

Backplane

Interface

External

Optical/IO

Interface

Expansion

Interface

Application

Scenario

EL12PRCA5A001

6U VPX

5HP

(Air Cooling)

0℃ ~

+55℃

FPGA:

8GB

DDR4;

GPU:

Max 12GB

LPDDR4

+ Max

64GB

eMMC

Max:

TOPS

@INT8

XCVU3P +

HUAWEI

ATLAS-

200I-A2

(314Pin MXM)

FPGA:

PCIe3.0 x8

Serdes to P1;

GPU:

PCIe3.0 x4

+ SPI to P1

1 x QSFP28,

GigE,

HDMI,

USB3.0,

MIPI DSI,

SD Card,

Type-C

JTAG,

SSMC

1 × FMC+

HSPC

(VITA57.4)

Edge AI inference, multi-sensor data fusion, remote sensing analysis, aviation intelligent monitoring, rugged parallel computing

EL12PRCA5A002

6U VPX

7HP

(Air Cooling)

-43℃ ~

+65℃

4×24GB

LPDDR4

+ Max

64GB

Emmc

Total:

352

TOPS

@INT8

(176

TFLOPS

@FP16)

Dual

HUAWEI

ASCEND

310P

2×PCIe4.0 x16

(Compatible

with

PCIe3.0/2.0

x8/x4)

2 × Type-C

Debug

Ports,

1 Reset

Switch,

Indicators

8 x HCCS

Inter-chip

Real-time target recognition, radar signal processing, multi-channel video analysis, mobile embedded intelligent system

EL12PRCA5A003

6U VPX

5HP

(Air Cooling)

Commercial:

0℃ ~ +55℃

(Ventilated

rack only);

Industrial:

-40℃ ~ +55℃

(Intermittent

operation,

good

ventilation

required)

2×16GB

GDDR6

(Dual RTX

A4500), or

2×16GB

GDDR5

(Dual Quadro

P5000)

Single

A4500:

19.35

TFLOPS

@FP32);

Single

P5000:

6.49

TFLOPS

@FP32

Dual

MXM3.1,

support

NVIDIA

dual

RTX-A4500

or dual

Quadro-P5000

2×PCIe3.0x8

(P1, P5),

1×PCIe3.0x16

(P2),

4×DP

(P6)

Front

Panel:

2×VGA,

2×DP

Dual

MXM3.1

Radar signal processing, 3D simulation, remote sensing image analysis, offline AI training, aviation & mobile rugged computing

EL12PRCA5B003

6U VPX

10HP

(Conduction

Cooling)

Commercial:

0℃ ~ +55℃;

Industrial:

-40℃ ~ +55℃

(Continuous

full-load

operation

supported

in sealed

rugged

chassis)

EL12PRCA5A004

6U VPX

5HP

(Conduction

Cooling)

-20℃ ~

+60℃

16GB

HBM2E

(MR-V50),

or 32GB

HBM2E

(MR-V100)

MR-V100:

295

TOPS

@INT8

(96

TFLOPS

@FP16);

MR-V50:

192

TOPS

@INT8

(65

TFLOPS

@FP16)

Single

MXM3.1,

support

ILUVATAR

MR-V100

or MR-V50

PCIe4.0

x16/x8

(Backward

Compatible

with

PCIe

3.0/2.0/1.0)

2 × HDMI,

2 × DVI,

1×DP

Single

MXM3.1

Type-A

Multi-modal data analysis, edge intelligent detection, real-time image processing, industrial rugged embedded computing

EL12PRCA5A005

6U VPX

5HP

(Air Cooling)

0℃ ~

+55℃

8GB

GDDR6

(RTX3070),

or 16GB

GDDR5

(Quadro

P5000M),

or 8GB

GDDR5

(GTX1070)

RTX3070:

20.3

TFLOPS

@FP32;

P5000M:

6.49

TFLOPS

@FP32;

GTX1070M:

7.42

TFLOPS

@FP32

Single

MXM3.1,

support

NVIDIA

RTX3070, or

Quadro-

P5000M or

GTX1070M

PCIe 3.0 ×8

2 × HDMI,

2 × DVI,

1×DP

Single

MXM3.1

Machine vision, parallel signal computation, geographic mapping, industrial simulation, rugged embedded data processing

EL12PRCA5A006

3U VPX

5HP

(Air Cooling)

Commercial:

-20℃ ~

+60℃

(Ventilated

rack only,

intermittent

full-load）

32GB

LPDDR5 +

64GB

eMMC

(AGX Orin

32GB), or

64GB

LPDDR5 +

64GB

eMMC

(AGX Orin

64GB)

AGX

Orin32GB:

200

TOPS

@INT8;

AGX

Orin 64GB:

275

TOPS

@INT8

NVIDIA

Jetson

AGX

Orin

32GB/64GB

PCIe3.0 x8,

PCIe2.0 x1;

4×GigE,

2×SATA,

RS232,

RS422,

4×GPIO

Front

Panel:

1×HDMI,

1×USB2.0,

1×USB3.0,

1×GigE,

J30J

Debug

Port

M.2

NVMe

Storage

Multi-channel video analysis, real-time target detection, edge AI inference, aviation intelligent perception, embedded vision

EL12PRCA5B006

3U VPX

5HP

(Conduction

Cooling)

Industrial:

-40℃ ~

+80℃

(Continuous

full-load

in sealed

rugged

chassis）

EL12PRCA5A007

3U VPX

5HP

(Air Cooling)

0℃ ~

+55℃

(Ventilated

rack only,

intermittent

full-load

operation)

12GB

GDDR6

10.94

TFLOPS

@FP32

(10.94

TFLOPS

@FP16)

Single

MXM3.1,

NVIDIA

RTX3060

PCIe 3.0 x8

(P1);

4×DP

Reserved

(P6)

Front

Panel:

3 × DP

High-

definition

Display

Ports

Single

MXM3.1

Type-B

High-speed image rendering, machine vision inspection, industrial edge computing, rugged display & data processing

EL12PRCA5B007

3U VPX

10HP

(Conduction

Cooling)

0℃ ~

+55℃

(Continuous

full-load

operation

supported

in sealed

rugged

chassis)

EL12PRCA5A008

3U VPX

4HP

(Conduction

Cooling)

-25℃ ~

+80℃

8GB LPDDR4

+16GB eMMC

( Jetson Xavier NX 8GB), or

16GB LPDDR4

+16GB eMMC

( Jetson Xavier NX 16GB)

TOPS

@INT8

NVIDIA

Jetson

Xavier

1×GigE,

1×RS422

Front

Panel:

1×HDMI,

2×Micro

USB2.0,

1×Type-C

Debug

Port

M.2

NVMe

Storage

Lightweight edge AI detection, multi-sensor fusion, mobile terminal monitoring, embedded real-time vision analysis

EL12PRCA5A009

3U VPX

5HP

(Air Cooling)

0℃ ~

+55℃

32GB

LPDDR4 +

32GB

eMMC

TOPS

@INT8

NVIDIA

Jetson

AGX

Xavier

PCIe3.0x8;

4×GigE,

2×SATA,

RS232,

RS485,

4×GPIO,

SPI,

I2C

Front

Panel:

1×HDMI,

2×USB2.0/3.0,

1×RS232

M.2

NVMe

Storage

Real-time video analytics, target tracking, industrial IoT edge computing, aviation embedded intelligent system

EL12PRCA5A010

3U VPX

5HP

(Conduction

Cooling)

-40℃ ~

+70℃

4GB

LPDDR4 +

16GB

eMMC

TFLOPS

@FP32

NVIDIA

Jetson

TX2

PCIe3.0

Switch

with

PCIe2.0x4

+PCIe1.0,

2×GigE,

1×RS422

1×HDMI,

1×USB2.0

OTG,

2×USB3.0,

6×MIPI

CSI-2

Camera

Input

Compatible

with

RTG004

RTM

Rear

Transition

Module

Low-power embedded data acquisition, small-scale image recognition, mobile terminal control, portable rugged computing

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