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VPX RFSoC Wideband Boards
This portfolio includes 3U compact and 6U high-performance VPX RFSoC heterogeneous processing boards, built on Xilinx Zynq RFSoC technology. Featuring integrated multi-channel wideband RF ADC/DAC, high-speed backplane interconnection and flexible FMC expansion, these ruggedized platforms deliver powerful real-time signal processing capability. They are widely deployed in broadband wireless communication, radar systems, electronic test and measurement, and other mission-critical embedded systems.
Product Selction Table (3U VPX)
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory | High-speed Interface | Power Consumption | Operating Temperature | Application Scenario |
| EL12PRCA3A001 | XCZU47DR RFSoC | TMS 320C6678 | 4T4R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 256MB DDR4 PL 512MB DDR4 DSP: 512MB DDR3 1×QSPI Flash | EMIF SRIO GTX SPI GigE LVDS | ≤45W | -40℃ ~+70℃ | Wireless Radio, Signal Measure , Industrial Computing |
| EL12PRCA3A002 | XCZU47DR RFSoC | None | 8T8R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 8GB DDR4 PL 4GB DDR4 1×QSPI Flash | GTY LVDS GigE | ≤45W | -40℃ ~+70℃ | Wireless Radio , Array Signal Pocessing, Multi-Channel Data Acquisition and Analysis |
| EL12PRCA3A003 | XCZU47DR RFSoC | None | 8T8R | 10MHz–10GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 8GB DDR4 PL 4GB DDR4 1×QSPI Flash 256Gb Emmc | GTY*8 PCIe4.0*8 GigE LVDS*20 USB3.0 | 12V | -40℃ ~+85℃ | Wireless Radio , SDR, Multi-Channel Signal Acquisition and Spectrum Analysis |
Product Selction Table (6U VPX)
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory | High-speed Interface | Power Consumption | Operating Temperature | Application Scenario |
| EL12PRCA3A004 | XCZU47DR RFSoC | XCVU13P | 8T8R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 8GB DDR4 PL 2GB DDR4 XCVU13P: 32GB DDR4 | QSFP×2 FMC HPC GigE VPX backplane bus | 12V DC 60W | -40℃ ~ +70℃ | Wideband radio , Satellite Link, Signal Capture & Playback, Heterogeneous Computing |
| EL12PRCA3A005 | XCZU47DR RFSoC | XCVU9P | 8T8R | DC-6GH ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 4GB DDR4 PL 8GB DDR4 XCVU9P: 4GB DDR4 | SFP+ optical GigE VPX backplane bus | 28V DC | -40℃ ~+85℃ | 5G mmWave, Satellite Link, Wideband SDR , Precision RF Test & Measurement |
| EL12PRCA3A006 | XCZU47DR RFSoC | None | Native 8T Expandable Max 8R via FMC | 5MHz–18GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 4GB DDR4 PL 8GB DDR4 QSPI Flash 2×512Mb | Aurora*8 PCIe 4.0*8 backplane GigE M.2 SSD | Standard VPX P0 supply ATX compatible | 0℃ ~ +55℃ | SDR, High- Speed Signal Acquisition, Real-Time Algorithm Verification |
| EL12PRCA3A007 | XCZU47DR RFSoC | None | Native 8T Swapable Multi-Type FMC, Max 8R | 5MHz–18GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS: 4GB DDR4 PL: 8GB DDR4 QSPI Flash 2×512Mb | GTY*8 PCIe 4.0*8 backplane GigE M.2 SSD | Standard VPX P0 supply ATX compatible | 0℃ ~ +55℃ | SDR, High- Speed Signal Capture, Algorithm Validation |
PN.: EL12PRCA3A001
XCZU47DR + TMS320C6678 3U VPX Heterogeneous 4T4R RF Sampling Processing Platform
Key Features
3U VPX heterogeneous platform built on XCZU47DR RFSoC and 8-core DSP. Integrated 4-channel RF ADC/DAC for direct RF sampling. High-speed EMIF & SRIO enable efficient inter-chip data exchange. Supports clock configuration and remote firmware update. Ample memory and rich interfaces ensure stable high-speed transmission under wide temperature.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR + TMS320C6678 | ||||||||
| RF Sampling | 4T4R | ||||||||
| ADC 14-bit@5GSPS, | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 256MB DDR4, PL 512MB DDR4 | ||||||||
| DSP: 512MB DDR3 | |||||||||
| 1×QSPI Flash | |||||||||
| Inter-Chip Interface | EMIF, SRIO, GTX×4, SPI | ||||||||
| High-Speed Interface | 4 × QSFP | ||||||||
| Peripherals | GigE, RS422, LVDS, SRIO | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 18~36V VPX backplane power | ||||||||
Block Diagram
Applications
Wireless radio, signal measurement, industrial computing
PN.: EL12PRCA3A002
XCZU47DR 3U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
3U VPX rugged platform based on XCZU47DR RFSoC. Adopts 8×8 RF ADC/DAC for direct RF sampling, ideal for MIMO and beamforming. Equipped with large-capacity DDR4 and QSPI Flash, supporting stable operation in wide temperature range. Rich high-speed interfaces enable multi-board cascading and high-throughput system integration.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR Gen2 | ||||||||
| RF Sampling | 8T8R | ||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | PS 8GB DDR4, PL 4GB DDR4 | ||||||||
| 1×QSPI Flash | |||||||||
| High-Speed Interface | GTY×16, LVDS×8 | ||||||||
| Peripherals | GigE, UART, RS422, USB Debug | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 28V DC (VPX backplane power) | ||||||||
| Power Consumption | ≤45W | ||||||||
Block Diagram
Applications
Broadband wireless radio, array signal processing, multi-channel data acquisition and analysis
PN.: EL12PRCA3A003
XCZU47DR 3U VPX Heterogeneous Wide Band 8T8R RF Sampling Processing Platform
Key Features
Based on XCZU47DR RFSoC, it features multi-core processors, abundant FPGA logic and DSP resources, plus large-capacity DDR4 memory for powerful real-time computing. Equipped with PCIe Gen4, multiple high-speed interfaces and diversified storage, it supports high-throughput data transmission and flexible expansion. The wide-temperature design ensures stable operation in harsh embedded scenarios.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR Gen3 | ||||||||
| RF Sampling | 8T8R | ||||||||
| Bandwidth10MHz–10GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS, | |||||||||
| Memory | PS 8GB DDR4, PL 4GB DDR4 | ||||||||
| 1×QSPI Flash | |||||||||
| 256GB eMMC | |||||||||
| High-Speed Interfaces | GTY×8, PCIe4.0×8, GigE, USB3.0, DP | ||||||||
| Peripherals | RS232/RS422, TTL, GPIO, JTAG, External Clock Input | ||||||||
| Front Panel Interface | SSMC , External LO Input | ||||||||
| Power Supply | 12V | ||||||||
| Operating Temp. | -40°C ~ +85°C | ||||||||
Block Diagram
Applications
Broadband & long-range wireless communication, SDR, high-precision test measurement, multi-channel signal acquisition and spectrum analysis
PN.: EL12PRCA3A004
XCZU47DR+XCVU13P 6U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
Rugged 6U VPX dual-chip platform: XCVU13P FPGA + XCZU47DR RFSoC. Integrated 8T8R 14-bit direct RF sampling transceivers. GTY & LVDS high-speed inter-FPGA interconnect. Tiered DDR4 memory, eMMC & multi-boot flash storage. Dual QSFP, FMC-HPC, Gigabit Ethernet & VPX backplane ports. -40℃~+70℃ wide-temperature industrial rugged design.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR + XCVU13P | ||||||||
| RF Sampling | 8T8R | ||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 8GB DDR4, PL 2GB DDR4 | ||||||||
| XCVU13P: 32GB DDR4 | |||||||||
| Inter-Chip Interface | GTY×8, LVDS×6, Slave SelectMAP×8 | ||||||||
| High-speed Interface | QSFP×2, FMC HPC, GigE, VPX backplane bus | ||||||||
| Power Consumption | 12V DC, 60W | ||||||||
| Operating Temp | -40℃ ~ +70℃ | ||||||||
Block Diagram
Applications
Wideband radio, satellite link, signal capture & playback, RF test measurement, heterogeneous computing
PN.: EL12PRCA3A005
XCZU47DR+XCVU9P 6U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
Rugged 6U VPX dual-chip platform: XCVU9P FPGA + XCZU47DR RFSoC
8T8R RF channels, DC–6GHz coverage, 14-bit 5GSPS ADC, 9.8GSPS DAC
High channel isolation >60dB, stable linearity & amplitude-phase matching
Massive DDR4 memory banks, abundant GTY transceivers, optical & Gigabit Ethernet ports
Rich digital I/O: RS485/422, TTL, USB-C, SD card, JTAG debug
28V DC VPX power input, industrial rugged hardware layout
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR + XCVU9P | ||||||||
| RF Sampling | 8T8R | ||||||||
| Bandwidth DC-6GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 4GB DDR4, PL 8GB DDR4 | ||||||||
| XCVU9P: 4GB DDR4 | |||||||||
| Inter-Chip Interface | GTY×8, LVDS×32, TTL×32 | ||||||||
| High-speed Interface | SFP+ optical, GigE, VPX backplane bus | ||||||||
| Power Consumption | 28V DC | ||||||||
| Operating Temp | -40℃~+85℃ | ||||||||
Block Diagram
Applications
5G mmWave, satellite link, wideband SDR, precision RF test & measurement
PN.: EL12PRCA3A006
XCZU47DR 6U VPX Heterogeneous 8T RF Sampling Processing Platform, Expandable Max 8R via 4GSPS FMC-HPC ADC-Only
Key Features
6U VPX single-chip design powered by XCZU47DR RFSoC
8-channel 14-bit 9.85GS/s onboard DA, expandable to 8-channel 4GS/s AD via mezzanine card
5MHz–18GHz analog input bandwidth with sample-and-hold circuitry
Split PS/PL DDR4 architecture, total 12GB memory plus multi-format storage interfaces
Full clock, trigger, GPS & PPS timing signal ports
Aurora x8 & PCIe 4.0 x8 VPX backplane high-speed links
Complete debug ports, thermal/power monitoring, 0℃~+55℃ operating range
FMC interface exclusively engineered for 8-channel ADC acquisition mezzanine.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR | ||||||||
| RF Sampling | Native 8T + Max 8R via expandable ADC FMC | ||||||||
| Bandwidth 5MHz–18GHz | |||||||||
| ADC 14-bit@4GSPS | |||||||||
| DAC 14-bit@9.85GSPS, | |||||||||
| Memory | PS: 4GB DDR4, PL: 8GB DDR4 | ||||||||
| 2×512Mb QSPI Flash | |||||||||
| High-speed Interface | Aurora*8, PCIe 4.0*8 backplane, GigE, M.2 SSD | ||||||||
| Power Consumption | Standard VPX P0 supply, ATX compatible | ||||||||
| Operating Temp | 0℃ ~ +55℃ | ||||||||
Block Diagram
Applications
SDR, high-speed signal acquisition, real-time algorithm verification, RF test & measurement
PN.: EL12PRCA3A007
XCZU47DR 6U VPX Heterogeneous 8T RF Sampling Processing Platform, Swapable Multi-Type FMC-HPC, Max 8R via 5GSPS ADC
Key Features
6U VPX single XCZU47DR RFSoC architecture
8-channel 14-bit 9.85GS/s onboard DA; swapable mezzanine for max 8CH 14-bit 5GS/s AD
Split PS/PL DDR4, total 12GB memory + dual QSPI Flash storage
Full clock, trigger & sync MMCX timing ports
GTY ×8 & PCIe 4.0 ×8 VPX backplane high-speed links
Gigabit Ethernet, Type-C debug, M.2 SSD & MicroSD storage
Onboard thermal & power monitoring, 0℃~+55℃ operating temperature
Universal FMC-HPC slot supports ADC, DAC, IF transverter & high-speed digital mezzanine modules.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR | ||||||||
| RF Sampling | Native 8T + Max 8R via swapable ADC FMC | ||||||||
| Bandwidth 5MHz–18GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | PS: 4GB DDR4, PL: 8GB DDR4 | ||||||||
| 2×512Mb QSPI Flash | |||||||||
| High-speed Interface | GTY*8, PCIe 4.0*8 backplane, GigE, M.2 SSD | ||||||||
| Power Consumption | Standard VPX P0 supply, ATX compatible | ||||||||
| Operating Temp | 0℃ ~ +55℃ | ||||||||
Block Diagram
Applications
SDR, high-speed signal capture, algorithm validation, RF test & measurement
Ordering
| PN: | All above | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Contact: Windy Lian
Phone: 13862120662
E-mail: sales@north-bridges.com
Whatsapp:
Add: Suzhou City, China
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