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Disclaimer:
Product specifications on the website are for reference only, subject to the latest manufacturer-confirmed datasheet. Please contact us for official technical documents before project evaluation and quotation.
Operating system, BSP, drivers and SDK vary by hardware batch. Please contact us for official software compatibility documents before project development.
VPX RFSoC Wideband Boards
This portfolio includes 3U compact and 6U high-performance VPX RFSoC heterogeneous processing boards, built on Xilinx Zynq RFSoC technology. Featuring integrated multi-channel wideband RF ADC/DAC, high-speed backplane interconnection and flexible FMC expansion, these ruggedized platforms deliver powerful real-time signal processing capability. They are widely deployed in broadband wireless communication, radar systems, electronic test and measurement, and other mission-critical embedded systems.
Note: For SOSA-aligned rear blind-mate RF system deployment, pair with our VITA67 RF Hybrid Custom Backplane series.
Product Selction Table (3U VPX)
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory | High-speed Interface | Power Consumption | Operating Temperature | Application Scenario |
| EL12PRCA3A001 | XCZU47DR RFSoC | TMS 320C6678 | 4T4R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 256MB DDR4 PL 512MB DDR4 DSP: 512MB DDR3 1×QSPI Flash | EMIF SRIO GTX SPI GigE LVDS | ≤45W | -40℃ ~+70℃ | Wireless Radio, Signal Measure , Industrial Computing |
| EL12PRCA3A002 | XCZU47DR RFSoC | None | 8T8R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 8GB DDR4 PL 4GB DDR4 1×QSPI Flash | GTY LVDS GigE | ≤45W | -40℃ ~+70℃ | Wireless Radio , Array Signal Pocessing, Multi-Channel Data Acquisition and Analysis |
| EL12PRCA3A003 | XCZU47DR RFSoC | None | 8T8R | 10MHz–10GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 8GB DDR4 PL 4GB DDR4 1×QSPI Flash 256Gb Emmc | GTY*8 PCIe4.0*8 GigE LVDS*20 USB3.0 | 12V | -40℃ ~+85℃ | Wireless Radio , SDR, Multi-Channel Signal Acquisition and Spectrum Analysis |
Product Selction Table (6U VPX)
| Part Number | Main FPGA Chip | Auxiliary Processor | RF/Analog Interface | Max Transmission Bandwidth | Onboard Memory | High-speed Interface | Power Consumption | Operating Temperature | Application Scenario |
| EL12PRCA3A004 | XCZU47DR RFSoC | XCVU13P | 8T8R | ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 8GB DDR4 PL 2GB DDR4 XCVU13P: 32GB DDR4 | QSFP×2 FMC HPC GigE VPX backplane bus | 12V DC 60W | -40℃ ~ +70℃ | Wideband radio , Satellite Link, Signal Capture & Playback, Heterogeneous Computing |
| EL12PRCA3A005 | XCZU47DR RFSoC | XCVU9P | 8T8R | DC-6GH ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | RFSoC: PS 4GB DDR4 PL 8GB DDR4 XCVU9P: 4GB DDR4 | SFP+ optical GigE VPX backplane bus | 28V DC | -40℃ ~+85℃ | 5G mmWave, Satellite Link, Wideband SDR , Precision RF Test & Measurement |
| EL12PRCA3A006 | XCZU47DR RFSoC | None | Native 8T Expandable Max 8R via FMC | 5MHz–18GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS 4GB DDR4 PL 8GB DDR4 QSPI Flash 2×512Mb | Aurora*8 PCIe 4.0*8 backplane GigE M.2 SSD | Standard VPX P0 supply ATX compatible | 0℃ ~ +55℃ | SDR, High- Speed Signal Acquisition, Real-Time Algorithm Verification |
| EL12PRCA3A007 | XCZU47DR RFSoC | None | Native 8T Swapable Multi-Type FMC, Max 8R | 5MHz–18GHz ADC 14-bit @5GSPS DAC 14-bit @9.85GSPS | PS: 4GB DDR4 PL: 8GB DDR4 QSPI Flash 2×512Mb | GTY*8 PCIe 4.0*8 backplane GigE M.2 SSD | Standard VPX P0 supply ATX compatible | 0℃ ~ +55℃ | SDR, High- Speed Signal Capture, Algorithm Validation |
PN.: EL12PRCA3A001
XCZU47DR + TMS320C6678 3U VPX Heterogeneous 4T4R RF Sampling Processing Platform
Key Features
3U VPX heterogeneous platform built on XCZU47DR RFSoC and 8-core DSP. Integrated 4-channel RF ADC/DAC for direct RF sampling. High-speed EMIF & SRIO enable efficient inter-chip data exchange. Supports clock configuration and remote firmware update. Ample memory and rich interfaces ensure stable high-speed transmission under wide temperature.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR + TMS320C6678 | ||||||||
| RF Sampling | 4T4R | ||||||||
| ADC 14-bit@5GSPS, | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 256MB DDR4, PL 512MB DDR4 | ||||||||
| DSP: 512MB DDR3 | |||||||||
| 1×QSPI Flash | |||||||||
| Inter-Chip Interface | EMIF, SRIO, GTX×4, SPI | ||||||||
| High-Speed Interface | 4 × QSFP | ||||||||
| Peripherals | GigE, RS422, LVDS, SRIO | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 18~36V VPX backplane power | ||||||||
Block Diagram
Applications
Wireless radio, signal measurement, industrial computing
PN.: EL12PRCA3A002
XCZU47DR 3U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
3U VPX rugged platform based on XCZU47DR RFSoC. Adopts 8×8 RF ADC/DAC for direct RF sampling, ideal for MIMO and beamforming. Equipped with large-capacity DDR4 and QSPI Flash, supporting stable operation in wide temperature range. Rich high-speed interfaces enable multi-board cascading and high-throughput system integration.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR Gen2 | ||||||||
| RF Sampling | 8T8R | ||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | PS 8GB DDR4, PL 4GB DDR4 | ||||||||
| 1×QSPI Flash | |||||||||
| High-Speed Interface | GTY×16, LVDS×8 | ||||||||
| Peripherals | GigE, UART, RS422, USB Debug | ||||||||
| Operating Temp. | -40°C ~ +70°C | ||||||||
| Power Supply | 28V DC (VPX backplane power) | ||||||||
| Power Consumption | ≤45W | ||||||||
Block Diagram
Applications
Broadband wireless radio, array signal processing, multi-channel data acquisition and analysis
PN.: EL12PRCA3A003
XCZU47DR 3U VPX Heterogeneous Wide Band 8T8R RF Sampling Processing Platform
Key Features
Based on XCZU47DR RFSoC, it features multi-core processors, abundant FPGA logic and DSP resources, plus large-capacity DDR4 memory for powerful real-time computing. Equipped with PCIe Gen4, multiple high-speed interfaces and diversified storage, it supports high-throughput data transmission and flexible expansion. The wide-temperature design ensures stable operation in harsh embedded scenarios.
Specifications
| Form Factor | 3U VPX | ||||||||
| Chip | XCZU47DR Gen3 | ||||||||
| RF Sampling | 8T8R | ||||||||
| Bandwidth10MHz–10GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS, | |||||||||
| Memory | PS 8GB DDR4, PL 4GB DDR4 | ||||||||
| 1×QSPI Flash | |||||||||
| 256GB eMMC | |||||||||
| High-Speed Interfaces | GTY×8, PCIe4.0×8, GigE, USB3.0, DP | ||||||||
| Peripherals | RS232/RS422, TTL, GPIO, JTAG, External Clock Input | ||||||||
| Front Panel Interface | SSMC , External LO Input | ||||||||
| Power Supply | 12V | ||||||||
| Operating Temp. | -40°C ~ +85°C | ||||||||
Block Diagram
Applications
Broadband & long-range wireless communication, SDR, high-precision test measurement, multi-channel signal acquisition and spectrum analysis
PN.: EL12PRCA3A004
XCZU47DR+XCVU13P 6U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
Rugged 6U VPX dual-chip platform: XCVU13P FPGA + XCZU47DR RFSoC. Integrated 8T8R 14-bit direct RF sampling transceivers. GTY & LVDS high-speed inter-FPGA interconnect. Tiered DDR4 memory, eMMC & multi-boot flash storage. Dual QSFP, FMC-HPC, Gigabit Ethernet & VPX backplane ports. -40℃~+70℃ wide-temperature industrial rugged design.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR + XCVU13P | ||||||||
| RF Sampling | 8T8R | ||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 8GB DDR4, PL 2GB DDR4 | ||||||||
| XCVU13P: 32GB DDR4 | |||||||||
| Inter-Chip Interface | GTY×8, LVDS×6, Slave SelectMAP×8 | ||||||||
| High-speed Interface | QSFP×2, FMC HPC, GigE, VPX backplane bus | ||||||||
| Power Consumption | 12V DC, 60W | ||||||||
| Operating Temp | -40℃ ~ +70℃ | ||||||||
Block Diagram
Applications
Wideband radio, satellite link, signal capture & playback, RF test measurement, heterogeneous computing
PN.: EL12PRCA3A005
XCZU47DR+XCVU9P 6U VPX Heterogeneous 8T8R RF Sampling Processing Platform
Key Features
Rugged 6U VPX dual-chip platform: XCVU9P FPGA + XCZU47DR RFSoC
8T8R RF channels, DC–6GHz coverage, 14-bit 5GSPS ADC, 9.8GSPS DAC
High channel isolation >60dB, stable linearity & amplitude-phase matching
Massive DDR4 memory banks, abundant GTY transceivers, optical & Gigabit Ethernet ports
Rich digital I/O: RS485/422, TTL, USB-C, SD card, JTAG debug
28V DC VPX power input, industrial rugged hardware layout
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR + XCVU9P | ||||||||
| RF Sampling | 8T8R | ||||||||
| Bandwidth DC-6GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | RFSoC: PS 4GB DDR4, PL 8GB DDR4 | ||||||||
| XCVU9P: 4GB DDR4 | |||||||||
| Inter-Chip Interface | GTY×8, LVDS×32, TTL×32 | ||||||||
| High-speed Interface | SFP+ optical, GigE, VPX backplane bus | ||||||||
| Power Consumption | 28V DC | ||||||||
| Operating Temp | -40℃~+85℃ | ||||||||
Block Diagram
Applications
5G mmWave, satellite link, wideband SDR, precision RF test & measurement
PN.: EL12PRCA3A006
XCZU47DR 6U VPX Heterogeneous 8T RF Sampling Processing Platform, Expandable Max 8R via 4GSPS FMC-HPC ADC-Only
Key Features
6U VPX single-chip design powered by XCZU47DR RFSoC
8-channel 14-bit 9.85GS/s onboard DA, expandable to 8-channel 4GS/s AD via mezzanine card
5MHz–18GHz analog input bandwidth with sample-and-hold circuitry
Split PS/PL DDR4 architecture, total 12GB memory plus multi-format storage interfaces
Full clock, trigger, GPS & PPS timing signal ports
Aurora x8 & PCIe 4.0 x8 VPX backplane high-speed links
Complete debug ports, thermal/power monitoring, 0℃~+55℃ operating range
FMC interface exclusively engineered for 8-channel ADC acquisition mezzanine.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR | ||||||||
| RF Sampling | Native 8T + Max 8R via expandable ADC FMC | ||||||||
| Bandwidth 5MHz–18GHz | |||||||||
| ADC 14-bit@4GSPS | |||||||||
| DAC 14-bit@9.85GSPS, | |||||||||
| Memory | PS: 4GB DDR4, PL: 8GB DDR4 | ||||||||
| 2×512Mb QSPI Flash | |||||||||
| High-speed Interface | Aurora*8, PCIe 4.0*8 backplane, GigE, M.2 SSD | ||||||||
| Power Consumption | Standard VPX P0 supply, ATX compatible | ||||||||
| Operating Temp | 0℃ ~ +55℃ | ||||||||
Block Diagram
Applications
SDR, high-speed signal acquisition, real-time algorithm verification, RF test & measurement
PN.: EL12PRCA3A007
XCZU47DR 6U VPX Heterogeneous 8T RF Sampling Processing Platform, Swapable Multi-Type FMC-HPC, Max 8R via 5GSPS ADC
Key Features
6U VPX single XCZU47DR RFSoC architecture
8-channel 14-bit 9.85GS/s onboard DA; swapable mezzanine for max 8CH 14-bit 5GS/s AD
Split PS/PL DDR4, total 12GB memory + dual QSPI Flash storage
Full clock, trigger & sync MMCX timing ports
GTY ×8 & PCIe 4.0 ×8 VPX backplane high-speed links
Gigabit Ethernet, Type-C debug, M.2 SSD & MicroSD storage
Onboard thermal & power monitoring, 0℃~+55℃ operating temperature
Universal FMC-HPC slot supports ADC, DAC, IF transverter & high-speed digital mezzanine modules.
Specifications
| Form Factor | 6U VPX | ||||||||
| Chip | XCZU47DR | ||||||||
| RF Sampling | Native 8T + Max 8R via swapable ADC FMC | ||||||||
| Bandwidth 5MHz–18GHz | |||||||||
| ADC 14-bit@5GSPS | |||||||||
| DAC 14-bit@9.85GSPS | |||||||||
| Memory | PS: 4GB DDR4, PL: 8GB DDR4 | ||||||||
| 2×512Mb QSPI Flash | |||||||||
| High-speed Interface | GTY*8, PCIe 4.0*8 backplane, GigE, M.2 SSD | ||||||||
| Power Consumption | Standard VPX P0 supply, ATX compatible | ||||||||
| Operating Temp | 0℃ ~ +55℃ | ||||||||
Block Diagram
Applications
SDR, high-speed signal capture, algorithm validation, RF test & measurement
Ordering
| PN: | All above | ||||||||
| Lead time: | Inquire for official quotation | ||||||||
| Custom designs: | Available upon request | ||||||||
| Support: | FPGA reference design, schematic review, driver development (quoted separately) | ||||||||
Contact: Windy Lian
Phone: 13862120662
E-mail: sales@north-bridges.com
Whatsapp:
Add: Suzhou City, China
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